Vice President of Hardware Engineering
Lead the development of our next-generation, lightweight UAV imaging pods. You own the complete hardware lifecycle across mechanical, electrical, logical, and aerodynamic disciplines, bridging deep technical execution and high-level strategic leadership.
Technical leadership
- System architecture: define the hardware roadmap for lightweight, ultra-stabilised UAV imaging payloads.
- Multidisciplinary oversight: guide engineering teams across mechanical, electrical, logical, and aerodynamic domains.
- SWaP-C optimisation: drive strict size, weight, power, and cost strategies for aerial environments.
- Aerodynamic integration: oversee external pod geometry to minimise drag and eliminate wind-induced jitter.
Operational excellence
- DFM/DFA: implement rigorous design for manufacturing and assembly standards for rapid scaling.
- Vendor management: build and manage global supply chains for optical, custom, and composite components.
- Regulatory compliance: aerospace, FCC, CE, and military standards (e.g. MIL-STD-810H).
- Testing and validation: environmental testing across vibration, thermal, ingress protection, and wind tunnel trials.
Technical domains
- Mechanical and thermal: advanced lightweight composites, precision gimbals / BLDC / jitter stabilisation, thermal management for sealed high-density compute.
- Electrical: low-noise high-efficiency PDN, HDI and rigid-flex PCB, EMI/EMC mitigation against UAV telemetry.
- Logical and digital: high-speed sensor pipelines, edge AI (FPGA/SoC/ISP), MIPI, PCIe, Ethernet, high-bandwidth memory.
- Aerodynamics: CFD for the external pod, drag and boundary layer, aero-center impact on flight dynamics.
Qualifications
- Master's or Ph.D. in mechanical, electrical, aerospace, or robotics engineering.
- 10+ years in hardware development, 5+ years at director or VP level.
- Track record shipping aerospace, UAV, defense, or high-end robotics hardware.